MECHANICAL AND CHEMICAL POLISHING METHOD AND POLISHING APPARATUS THEREFOR

摘要

The invention provides a novel method of supplying a polishing liquid onto a surface of a polishing pad (6) through which a surface of a film (9) be polished wherein a solution (4) including an aggregation agent and a slurry (3) into which fine polishing particles (7) were already dispersed are separately supplied onto the polishing surface so that the slurry is mixed with the solution to thereby cause an aggregation of the fine polishing particles (11) to form aggregated particles to be used for polishing.