| 摘要 |
<p>A hybrid Johnsen-Rhabek chuck (100) that provides a combination of both Coulombic and Johnsen-Rahbek chucking mechanisms and contains a plurality of dielectric mesas (106) deposited upon particular regions of the support surface (110) of a chuck. The body (102) of the chuck is generally fabricated from a Johnsen-Rahbek semiconducting dielectric. The mesas (106) are formed from a thin film deposition of a highly-resistive dielectric. Consequently, the thin, highly resistive film prevents excess DC standby current as well as reduces the dependence of the electrostatic chuck performance on the wafer backside morphology and composition.</p> |
