DURO-PLASTIC COMPOSITE MATERIAL WITH EXPANDABLE HOLLOW MICROSPHERES AND USE OF THE SAME FOR ENCAPSULATION,申请号WO1998DE02796-传众专利搜索

发明名称	DURO-PLASTIC COMPOSITE MATERIAL WITH EXPANDABLE HOLLOW MICROSPHERES AND USE OF THE SAME FOR ENCAPSULATION
摘要	The invention relates to a housing surrounding an electric circuit with duro-plastic material (14) containing expandable hollow microspheres.
申请公布号	WO9915582(A1)	申请公布日期	1999.04.01
申请号	WO1998DE02796	申请日期	1998.09.21
申请人	SIEMENS AKTIENGESELLSCHAFT;HOUDEAU, DETLEF;ATZESDORFER, ALEXANDRA;BEDNARZ, JUERGEN;SCHMIDT, HANS-FRIEDRICH;WETTER, RAINER;LANG, WERNER;TEEPEN, FRANK;BREITENHUBER, HEINZ	发明人	HOUDEAU, DETLEF;ATZESDORFER, ALEXANDRA;BEDNARZ, JUERGEN;SCHMIDT, HANS-FRIEDRICH;WETTER, RAINER;LANG, WERNER;TEEPEN, FRANK;BREITENHUBER, HEINZ
分类号	B29C45/14;C08J9/32;H01L21/56;H01L23/29;H01L23/31;H01L23/495	主分类号	B29C45/14
代理机构		代理人
主权项
地址