发明名称 Integriertes Leistungs-Halbleiterbauelement mit Schutzstruktur
摘要 An integrated power semiconductor component includes a substrate of a first conduction type. At least one first region of a second conduction type is embedded in the substrate and at least one second region of the second conduction type is embedded in the substrate. A substrate contact supplies a supply voltage. Contact-making semiconductor components are embedded in the first region and in the second region. At least a portion of the semiconductor components in the first region control at least a portion of the semiconductor components in the second region. A third region of the second conduction type is disposed between the first region and the second region, and the first region and the third region are at different potentials.
申请公布号 DE4423733(C2) 申请公布日期 1999.04.01
申请号 DE19944423733 申请日期 1994.07.06
申请人 SIEMENS AG, 80333 MUENCHEN, DE 发明人 GANTIOLER, JOSEF, DIPL.-ING., 81925 MUENCHEN, DE;SANDER, RAINALD, DIPL.-PHYS., 81379 MUENCHEN, DE;TIHANYI, JENOE, DR.-ING., 80689 MUENCHEN, DE;LEIPOLD, LUDWIG, DIPL.-ING., 81929 MUENCHEN, DE;STENGL, JENS-PEER, 82284 GRAFRATH, DE
分类号 H01L27/04;H01L21/822;H01L21/8234;H01L27/02;H01L27/088;(IPC1-7):H01L23/58;H01L27/06 主分类号 H01L27/04
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