发明名称 Hard solder composite
摘要 The insert in the strip shaped solder matrix is a wire net (1). The wires (2) running in the longitudinal direction of the strip consists of a metal or a metal alloy whose liquidus temperature is approximately equal to or lower than the liquidus temperature of the solder. The wires (3) oriented across the strip direction have a liquidus temperature above the liquidus temperature of the solder.
申请公布号 DE19742030(A1) 申请公布日期 1999.04.01
申请号 DE19971042030 申请日期 1997.09.24
申请人 DEGUSSA AG, 60311 FRANKFURT, DE 发明人 KOSCHLIG, MANFRED, DR., 63743 ASCHAFFENBURG, DE;FAULHABER, JOSEF, 63456 HANAU, DE;BENZING, MICHAEL, 63579 FREIGERICHT, DE
分类号 B23K35/02;B23K35/14;(IPC1-7):B23K35/02;B23K35/22 主分类号 B23K35/02
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