ARTICLE AND METHOD FOR TEMPORARILY SECURING A FLEXIBLE CIRCUIT TO A RIGID MEMBER

摘要

An article and process provides accurate alignment and a temporary bond between flexible circuit layers (12) and stiffening members (16) during the lay-up process prior to subsequent lamination steps. Plated metal features (26) located on the flexible circuitry (12) are extruded through holes (30) in an intermediate adhesive layer (14), then compressed against the wall of a hole (32) in the stiffening member (16). The extruded material (26) is plastically deformed and thereby temporarily secures the assembly (10) of flexible circuit (12), adhesive (14) and stiffening member (16) through a friction fit in the hole (32). This temporary bond allows the assembly to be picked up and placed on a lamination plate while retaining alignment of the components.