发明名称 METHOD FOR ELECTROPLATING NONCONDUCTIVE MATERIAL
摘要 <p>This invention provides a method of electroplating a non-conductive material, the method comprising the steps of bringing a non-conductive material into contact with an acidic hydrosol solution containing a palladium compound, a stannous compound and a copper compound, bringing the material into contact with an aqueous alkaline solution, and electroplating the material. According to the method of the invention, a desired coating having an excellent decorative appearance can be formed by electroplating without involving electroless plating on even a non-conductive material having a large area such as plastic molded components.</p>
申请公布号 EP0905285(A1) 申请公布日期 1999.03.31
申请号 EP19970901820 申请日期 1997.02.03
申请人 OKUNO CHEMICAL INDUSTRY CO., LTD. 发明人 MATSUNAMI, TAKASHI;IKEDA, MASAHIKO;OKA, HIROYUKI
分类号 C25D5/56;(IPC1-7):C25D5/56 主分类号 C25D5/56
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