发明名称 |
METHOD FOR ELECTROPLATING NONCONDUCTIVE MATERIAL |
摘要 |
<p>This invention provides a method of electroplating a non-conductive material, the method comprising the steps of bringing a non-conductive material into contact with an acidic hydrosol solution containing a palladium compound, a stannous compound and a copper compound, bringing the material into contact with an aqueous alkaline solution, and electroplating the material. According to the method of the invention, a desired coating having an excellent decorative appearance can be formed by electroplating without involving electroless plating on even a non-conductive material having a large area such as plastic molded components.</p> |
申请公布号 |
EP0905285(A1) |
申请公布日期 |
1999.03.31 |
申请号 |
EP19970901820 |
申请日期 |
1997.02.03 |
申请人 |
OKUNO CHEMICAL INDUSTRY CO., LTD. |
发明人 |
MATSUNAMI, TAKASHI;IKEDA, MASAHIKO;OKA, HIROYUKI |
分类号 |
C25D5/56;(IPC1-7):C25D5/56 |
主分类号 |
C25D5/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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