| 摘要 |
A solder material 10 suitable for fluxless soldering attachment of a component 12 to a substrate 14 in a microelectronic assembly 16 such as a hybrid package comprises a core 18 and a gold layer 20 on the core. The core can comprise an alloy of tin and lead. The core preferably consists essentially of at least about 30 wt.% tin and the balance lead, so that it melts at temperatures of less than about 250 DEG C. The gold layer is preferably applied to the core using an electroless plating process that forms a highly uniform gold layer. The solder material provides a joint between the component and the substrate comprising less than about 3 wt.% gold. <IMAGE> |
