| 摘要 |
<p>A method, in an RF-based plasma processing chamber 600, for performing a planarization etch and a recess etch of a first layer on a semiconductor wafer 614. The method includes placing the semiconductor wafer, including a trench formed therein, into the plasma processing chamber. The method also includes depositing the first layer over a surface of the semiconductor and into the trench. There is further included performing the planarization etch to substantially planarize the first layer in the plasma processing chamber, the planarization etch being performed with a first ion density level. Additionally, there is included performing, using the plasma processing chamber, the recess etch on the first layer to recess the first layer within the trench. The recess etch is performed with a second ion density level in the plasma processing chamber, with the second ion density level being higher than the first ion density level. <IMAGE></p> |
