发明名称 LIGAND GOLD BONDING
摘要 Gold sol coated with alkanethiols and alkanethiol derivatives, which provide groups on the sol available for the linking of binding moieties such as antibodies, antigens or ligands to the gold sol. Di- and tri-thiol compounds bound to gold sol also facilitate the adsorption of antibodies, antigens or ligands to the sol. The coating process, and test kits incorporating the coated sols are also included.
申请公布号 KR0163790(B1) 申请公布日期 1999.03.30
申请号 KR19910022122 申请日期 1991.12.04
申请人 AKZO N.V. 发明人 SHIGEKAWA, BRIAN LAYNE;HSIEH, YUNG-AO
分类号 B22F1/02;B01J13/00;C07C321/04;C07C323/12;C07C323/25;C07C323/52;G01N33/543;G01N33/547;G01N33/553;G01N33/58;(IPC1-7):G01N33/53 主分类号 B22F1/02
代理机构 代理人
主权项
地址
您可能感兴趣的专利