发明名称 |
Method for applying curable fill composition to apertures in a substrate |
摘要 |
The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, the fill composition provides support for the solder joint and provides a flat solderable surface for the inter-connection. In certain embodiments, the cured fill compositions, offer a further advantage of being conductive. The invention also relates to several novel methods for filling through holes with such fill compositions, and to resistors located in through holes and vias.
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申请公布号 |
US5887345(A) |
申请公布日期 |
1999.03.30 |
申请号 |
US19970960770 |
申请日期 |
1997.10.30 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
KULESZA, JOSEPH DUANE;MARKOVICH, VOYA RISTA;PAPATHOMAS, KOSTAS;SABIA, JOSEPH GENE |
分类号 |
B32B7/04;C08G59/40;C08G73/00;C08L63/00;C09D163/00;H01B1/20;H01B1/22;H01B1/24;H05K1/09;H05K1/11;H05K1/16;H05K3/00;H05K3/40;(IPC1-7):H05K3/12;H05K3/42;H05K3/34 |
主分类号 |
B32B7/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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