| 摘要 |
PROBLEM TO BE SOLVED: To obtain a manufacturing method for a semiconductor device having high heat radiating performance and being able to prevent outer leads from deforming. SOLUTION: A semiconductor manufacturing method is provided with a step in which a lead frame supported by a frame where outer leads 8 and inner leads 9 are prepared arranged radially, a step for preparing a heat sink 15 which has a major surface on which a pellet 23 is bonded and in which a bumper 18 is formed in a body at the four corners, a step for bonding the lead frame and the heat sink the outside of the bumper, a step for boring the pellet 23 the heat sink 15, a step for bridging a wire 25 between the pellet and the inner leads, a step for making a resin-sealing body 27 resin seal of the pellet, inner leads, and the major surface of the pellet side of the heart sink and a step for separating the bumper from the heat sink. As a result, the pellet has a high heat radiating performance due to contact with the heat sink and can be prevented from being bent due to the bumper enclosing the outer leads at the four corners of the resin sealed body. |
