| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a system for polishing a semiconductor wafer with stabilized polishing characteristics, without causing polishing flaws on the surface of the semiconductor wafer. SOLUTION: This system for polishing a semiconductor wafer comprises a slurry supply tank 1 for storing polishing slurry 2A, a slurry feed pump 3 for pressure feeding the polishing slurry 2A to a slurry delivery port 5 through a slurry supply piping 4, a unit 20 for transmitting ultrasonic waves to the slurry supply piping 4, a polishing cloth 7 for applying a polishing slurry 2B delivered from the slurry delivery port 5, a water carrier 8 for holding a semiconductor water 9, while bringing the surface thereof into pressure contact with the surface of the polishing cloth 7 coated with the polishing slurry 2B, and moving the semiconductor wafer 9 relative to the polishing cloth 7, and piping 11 for discharging liquid slurry from the surface of the polishing cloth 7.</p> |
