发明名称 |
Product and method for placing particles on contact pads of electronic devices |
摘要 |
An article for use in placing particles on contact pads of electronic devices comprises a surface having an array of tacky and non-tacky areas thereon, wherein the tacky areas are disposed either co-planar with the non-tacky areas or below the plane of the non-tacky areas, the tacky areas having a size and bonding strength suitable for adhesion of one particle thereto and is used to place particles from the tacky areas to contact pads of electronic devices, such as circuit boards used in semiconductor applications. <IMAGE> |
申请公布号 |
SG63769(A1) |
申请公布日期 |
1999.03.30 |
申请号 |
SG19970003907 |
申请日期 |
1997.10.29 |
申请人 |
E. I. DE PONT DE NEMOURS AND COMPANY. |
发明人 |
SALTZBERG MICHAEL AARON;CAIRNCROSS ALLAN;CONVERS RONALD JOHN;BEIKMOHAMADI ALLAN |
分类号 |
H01L21/48;H05K3/34;(IPC1-7):H01L21/48 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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