| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent a semiconductor wafer from having scratches and particles from adhering on the semiconductor wafer by improving the workability of handling, when observing the surface of the semiconductor wafer at inspection. SOLUTION: A pair of vacuum tweezers 1 have a vacuum-chuck pad 2 where a space part 3 and an air vent hole 4 are provided, a connection pipe 8, and a grip 9. A fixing part 9a of the connection pipe 8, an air passage 9b, a vacuum- chuck switch 10, and a motor drive switch 11 are provided at the grip 9. The space part 3 of the pad 2, the air vent hole 4, an air passage 8a formed inside the connection pipe 8, and an air passage 9b of the grip 9 communicating with a vacuum source and an exhaust path is formed. When the backside of a semiconductor wafer is vacuum-chucked to the space part of the pad 2 and the surface is directed upward and a motor 5 is driven, rotation of the pad 2 due to a drive shaft 6 and rotation of the semiconductor wafer within a plane take place and inspection can be made while observing the entire surface.</p> |
