Semiconductor device with a package having a plurality of bump electrodes and module with a plurality of semiconductor devices

摘要

A semiconductor device is formed of stacked first and second semiconductor substrates each having internal circuits which are packaged within a package having a plurality of bump electrodes on the top and bottom principal planes. The bump electrodes on the top principal plane of the package are electrically connected to the internal circuits of the first semiconductor substrate and the bump electrodes on the bottom plane of the semiconductor substrate are electrically connected to the internal circuit of the second semiconductor substrate with the first and second semiconductor substrates arranged in mirror symmetry both physically with respect to each other and with respect to signals to be input into or output from the internal circuits. Module structures using a plurality of the semiconductor devices mentioned above are also described.