发明名称 Method of manufacturing semiconductor memory device
摘要 A storage node electrode formed of doped amorphous silicon is provided on a silicon substrate. Silicon crystal grains are formed on the surface of the storage node electrode by annealing it in the atmosphere including PH3. A capacitor insulating film and a cell plate electrode are formed to cover the surface of the storage node electrode including silicon crystal grains. Larger silicon crystal grains are accordingly provided on the surface of the storage node electrode, resulting in increased capacitance of the capacitor.
申请公布号 US5888878(A) 申请公布日期 1999.03.30
申请号 US19970985900 申请日期 1997.12.05
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 TSUCHIMOTO, JUNICHI;MORI, KIYOSHI
分类号 H01L27/04;H01L21/02;H01L21/822;H01L21/8242;H01L27/108;(IPC1-7):H01L21/20 主分类号 H01L27/04
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