| 摘要 |
PROBLEM TO BE SOLVED: To enable replacing a semiconductor chip in a short period by a method wherein, after mounting of a laminated structure beam on the semiconductor chip, the lead frame part of the laminated structure beam is soldered to a substrate wiring part, and the semiconductor chip is fixed by applying pressure. SOLUTION: A lead frame 2 is deformed in several millimeters into a recessed shape in advance, one side of the lead frame 2 is soldered by resin using a molding mold similar to a semiconductor electronic part, and a laminated structure beam, in the shape wherein the lead frame 2 is extended in two directions, is manufactured. After a semiconductor chip 5 is mounted on the laminated structure beam, the laminated structure beam is placed on the semiconductor chip 5. The frame 2 of the laminated structure beam is soldered to a substrate wiring part, and the semiconductor chip 5 is fixed by pressing. As a result, the replacement cost of the semiconductor chip of flip chip connection can be cut down, and the connection operation can be finished in a short time. |
