| 摘要 |
PROBLEM TO BE SOLVED: To increase a wiring density without connecting fault, even in the case of wire swimming by incorporating a major axis and a minor axis in a flat surface shape of a via hole of at least one position. SOLUTION: A flat surface shape of a via hole for connecting an insulator- coated wire is accompanied with both a minor axis and a major axis. Thus, even in the case of wire swimming, the wire can be surely connected. Also, an angle of 45 or 90 deg. is formed between a wiring direction of the wire for connecting to the via hole and a long axis direction of a flat surface shape of the via hole to further effectively connect the wire. When the wiring direction of the wire adjacently wired to the via hole is parallel to the direction of the major aixes of the via hole, an interval of the via holes is increased to enhance a density of insulating coating to be wired. As the flat surface shape of the via hole 1 accompanied with both the long axis 2 and the short axis 3, an elliptical circle or the like is suitable. |
