| 摘要 |
PROBLEM TO BE SOLVED: To obtain a substrate delivery apparatus which eliminates a positional deviation due to the position error of a chuck and that of a temporary support part by a method wherein, when a wafer is held by both the temporary support part and the chuck, the measured value of the position of the temporary support part is corrected to be identical to that of the position of the chuck and the target position of a temporary-support-part position servo is corrected to be identical to that of a chuck position servo. SOLUTION: When a wafer is held by both a temporary support part TC and a chuck WC, the measured value of the temporarysupport-part position measuring means to be given to a temporary-support-part position servo means is corrected to be identical to that of a chuck-position measuring means. In addition, the target position of the temporary-support- part position servo means is corrected to be identical to that of a chuck-position servo means. Thereby, it is possible to prevent a dislocation generated owing to the position error of the chuck WC and that of the temporary support part TC. In addition, while the wafer is held simultaneously by a support face and a temporary support face TCS, the servo gain of the temporary-support-part position servo means is lowered, an oscillation is prevented wherein the servo system o the temporary support part TC interferes with that of the chuck WC, and a delivery deviation which is generated owing to the oscillation is eliminated. |
