| 发明名称 |
Method and apparatus for directly joining a chip to a heat sink |
| 摘要 |
The present invention relates generally to a new apparatus and method for directly joining a chip to a heat sink. More particularly, the invention encompasses an apparatus and a method that uses a double-sided, pressure-sensitive, thermally-conductive adhesive tape to directly join a chip or similar such device to a heat sink. <MATH> |
| 申请公布号 |
SG63520(A1) |
申请公布日期 |
1999.03.30 |
| 申请号 |
SG19950000347 |
申请日期 |
1995.04.27 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CALL ANSON JAY;POMPEO FRANK LOUIS;ZITZ JEFFREY ALLEN;MEISNER, STEPHEN, H. |
| 分类号 |
H01L23/40;H01L21/58;H01L23/367;H01L23/42;H01L23/498;H01L23/64;(IPC1-7):H01L23/36 |
主分类号 |
H01L23/40 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
