| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor device having one side sealed structure in which the device is protected against warp age or distortion and the sealing resin is prevented from flowing out. SOLUTION: The inner lead 5 of a lead frame is secured onto the functional surface of a semiconductor chip 1 through an adhesive tape 3, the forward end of the inner lead 5 is connected electrically with a electrode pad 2 on the semiconductor chip through a bonding wire 6 and then only the functional surface side of the semiconductor chip 1 is sealed with a potting resin 7. In such a semiconductor device, a dam for preventing the potting resin 7 from flowing out from above the semiconductor chip 1 is formed by installing a second adhesive tape 4 on the periphery of the functional surface of the semiconductor chip 1 and only the functional surface side of the semiconductor chip is resin sealed by potting the resin 7 to the inside surrounded by the dam.
|
