发明名称 Method for manufacturing polysilicon with relatively small line width
摘要 A method is provided for manufacturing a polysilicon with a relatively small line width. The method includes steps of: a) forming a first layer of photoresist with a line pattern having a first line interval and a first line width over the polysilicon; b) etching a portion of the polysilicon for forming the polysilicon with a second line interval x and a second line width y respectively equal to the first line interval and the first line width; c) forming a second layer of photoresist with a third line interval and a third line width over the polysilicon; d) etching another portion of the polysilicon for forming the polysilicon with a fourth line interval x', equal to the third line interval, and a fourth line width y'; e) depositing a polysilicon film over the polysilicon with the relatively small line width; and f) etching a portion of the polysilicon film to form sidewalls of the polysilicon with the relatively small line width for adjusting the relatively small line width of the polysilicon.
申请公布号 US5888904(A) 申请公布日期 1999.03.30
申请号 US19970991083 申请日期 1997.12.16
申请人 HOLTEK MICROELECTRONICS INC. 发明人 WU, KUO-CHIEN
分类号 H01L21/027;H01L21/3213;H01L21/84;H01L27/12;(IPC1-7):H01L21/44 主分类号 H01L21/027
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