| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface-grinding machine in a semiconductor production system in which cost can be reduced by shortening the working time, while effectively projecting the lower surface of a semiconductor wafer SOLUTION: A table 10 is provided with air ejection holes 18a, 18b, and the upper surface of a wafer 1 is ground by means of a grinding blade 13 with the lower surface of the wafer 1 which is supported by the pressure of ejected air. When the air pressure is imparted with a gradient, the wafer 1 can be floated obliquely. The wafer 1 is abutted, at one end part (orientation flatness) thereof, against a stopper 11 and is secured in place. Since grinding work can be conducted without bringing the lower surface of the wafer 1 into contact with the table 10, the lower surface of the wafer 1 requires no surface protection, resulting in shortening of working time and cost reduction. |
