发明名称 HEAT TREATMENT OF SILICON CARBIDE SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To obtain the stable surface of an SiC substrate, without causing a blackening of the SiC substrate at the time of a heat treatment of the silicon carbide substrate by a method, wherein in a heat-treatment process subsequent to an ion implantation into the silicon carbide substrate, the substrate is put in a roughly sealed container to heat-treat the substrate. SOLUTION: An SiC substrate 3, which is subjected to heat treatment, is put in an SiC container 2 and an SiC cover 1 is shut to form a sealed state in the container 2. This container 2 is put on a stage in a heating furnace to perform the heat treatment on the substrate 3. As a heating atmosphere, an argon or vacuum atmosphere is used. The interior or the container 2 is filled with Si vapor, which is evaporated from the inner surfaces of the container 2 and the cover 1. Owing to that, if the area of the substrate 3 is small in comparison with the areas of the inner surfaces of the container 2 and the cover 1, a blackening of the substrate 3 will not be generated. The container 2 is made by a method, wherein SiC materials of a thickness of 5 to 20μm, for example, are made to precipitate into a graphite mold by a CVD method, and components made by such a method so as to remove the mold of the graphite are combined with each other.
申请公布号 JPH1187257(A) 申请公布日期 1999.03.30
申请号 JP19970246559 申请日期 1997.09.11
申请人 FUJI ELECTRIC CO LTD 发明人 HIROSE TOMOJI;SAITO AKIRA
分类号 H01L21/265;(IPC1-7):H01L21/265 主分类号 H01L21/265
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