| 摘要 |
PROBLEM TO BE SOLVED: To reduce assembly costs or part costs, and to enlarge a part mounting space on a circuit substrate. SOLUTION: A conductive pattern 17 being a contact terminal for an I/O connector 20 is provided at the rear edge part of a circuit substrate 12 in an IC card 11. Also, a dust preventing frame part 18 surrounding the conductive pattern 17 which is equipped with an opening 18a into and from which an I/O connector 20 is inserted and extracted is provided at the rear edge part of an insulating frame 13 for housing and holding the circuit substrate 12. Thus, the back connector of the IC card 11 can be constituted. |
