| 摘要 |
<p>PROBLEM TO BE SOLVED: To enable a solder ball to crack less by a method wherein the connections of the wiring terminal electrode of a ball grid array board to the solder ball is made flat. SOLUTION: In a semiconductor device, the wiring terminal electrode 5 of a flip-chip type ball grid array(BGA) board 2 formed of a plastic wiring board manufactured through a build-up method is extended up to the flat surface of the board 2, the extended part 5A of the wiring terminal electrode 5 is electrically connected to the outer electrode 4 of a semiconductor chip l through a solder ball 3, and a gap between the BGA board 2 and the semiconductor chip 1 is sealed up with a sealing resin 6. Therefore, no voids are produced at the connections of the wiring terminal electrode 5 to the solder ball 3, so that the solder ball 3 is less cracked. By this arrangement connections between the wiring terminal electrode 5 of the BGA board 2 and the outer electrode 4 of the semiconductor chip 1 can be restrained from deteriorating in electrical connection life.</p> |
