| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve adhesion between a substrate and resin and moisture resistance by resin-molding from an upper face of the substrate over a side end face of the substrate. SOLUTION: A BGA-type semiconductor device A comprises a chip 2 fixed to an upper face of a substrate 1 made of glass epoxy resin, wherein the chip 2 makes a continuity with a solder ball 4 protruding on a backside of the substrate 1 via a bonding wire 3, A part above the substrate including the chip 2, the bonding wire 3 or the like is molded of resin 5. Molding of the resin 5 is performed from an upper face of the substrate 1 over side end faces 1-1. In addition, molding of the resin 5 is performed onto a backside end face 1-2 of the substrate 1. Thus not only the upper face of the substrate 1 but also sides are resin-molded, thereby preventing moisture absorption from between the upper face of the substrate 1 and a molding resin end rim and peel due to flexion of the substrate or contraction difference.</p> |
