| 摘要 |
PROBLEM TO BE SOLVED: To form bumps superior in reliability without affecting an Al film by treating chemicals, by evaporating or sputtering an under-bump metal for bump pads on an Al pattern, using the lift off method, and processing electroless plating to form the bumps. SOLUTION: A method comprises the steps of preparing a wafer 1 having an Al comb-like pattern 2, coating a lift off resist film 3 thereon, setting a mask 21, exposing and developing to form a pad pattern 4, depositing a Cr film 5 and Ni film 6, dissolving and peeling off the films 3, 5, 6, forming an under-bump metal 7, forming bump plating pads, and dipping in an electroless plating soln. to form an Ni-P plating, thereby forming bumps superior in reliability without affecting the Al film by treating chemicals. |
