发明名称 APPARATUS FOR SEALING SEMICONDUCTOR DEVICE WITH RESIN
摘要 PROBLEM TO BE SOLVED: To reduce a cost, by providing a resin feeder for feeding a seal resin, and means for feeding automatically conditioned air in a working chamber having a resin sealer to the resin feeder. SOLUTION: A resin feeder 4 has two partition plates 2 holding an air layer therebetween to partition from a press 7, thus blocking the convection heat from flowing from the press 7 to the feeder 4. A duct 1 (factory exhaust) at the ceiling of the feeder 4 exhausts the air out of the feeder 4, a fan 3 takes automatically conditioned air in a working chamber having a resin sealer to hold the humidity/temp. in the feeder 4, equal to that in the working chamber. During operating of the resin sealer, the convection heat from the press 7 is exhausted out of the chamber through the duct 1 to avoid deteriorating the resin in the feeder.
申请公布号 JPH1187384(A) 申请公布日期 1999.03.30
申请号 JP19970246936 申请日期 1997.09.11
申请人 NEC CORP 发明人 ISE HIROSHI
分类号 B29C45/18;F24F1/02;H01L21/56 主分类号 B29C45/18
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