| 摘要 |
PROBLEM TO BE SOLVED: To attain a high luminous intensity by employing a lead frame insusceptible to external stress thereby enhancing the reliability and heat dissipation of a product while allowing high current drive. SOLUTION: Mounting and connecting lead frames 21, 23 comprise a pair of outer frame parts 26 projecting from the opposite sides of a molding 24 in order to mount a circuit board, and inner frame parts 27 for coupling both outer frame parts 26. The inner frame parts 27 are disposed oppositely to each other and in parallel with each other. The molding 24 covering the majority of the lead frames 21, 23 is molded to cover the inner frame part 27 while surrounding an LED chip 20 with a light shielding material except the front part thereof. The LED chip 20 is covered with a translucent body 33. A part of the mounting lead frame 21 is exposed to the outside of the molding 24 as a heat dissipating part 29. |
