Process for arranging printed conductors on the surface of a semiconductor component

摘要

In a process for arranging printed conductors on the surface of a semiconductor component, distances from the first forbidden zones are maintained. This is accomplished by converting the first forbidden zones to second forbidden zones by enlargement, where the zones are enlarged in the x and y directions by a different factor than in the a and b directions. Then paths are produced outside of or at the edge of the second forbidden zones for the arrangement of printed conductors.