| 摘要 |
PROBLEM TO BE SOLVED: To prevent contact accidents between crossed wires by forming bonding wires in the shape of a loop which approximates in a form of letter M. SOLUTION: A first semiconductor chip 10 is fixed on an island. A second semiconductor chip 11 is fixed on the first semiconductor chip 10. The first semiconductor chip 10 and a lead terminal 17 are connected by a first bonding wire 16a, and the second semiconductor chip 11 and a lead terminal 17 are connected by a second bonding wire 16b. At least first and second bent parts 22 and 23 are formed on a first bonding wire 16a, and the bonding wire 16a is formed approximately in a shape of letter M by forming a loop and denting its midway. The second bonding wire 16b is extended above the dented part. The second bonding wire 16b is also formed approximately in a shape of letter M. The second bended part 25 is disposed above the proximity of the lead terminal 17. |
