发明名称 |
Circuit board cooling apparatus |
摘要 |
A supply pipe for supplying air to the peripheral surface of a circuit board container unit is provided in a test head. Nozzles are connected to the supply pipe. Each nozzle has at least one hole opposing a circuit board and corresponding to one IC on the circuit board. The circuit board has a parts mounted portion that generates a small amount of heat. The circuit board is covered with a case. A vent hole is formed on the microscope column side. A discharge pipe is connected to the vent hole and communicates with the outside of the test head. With this arrangement, each circuit board can be uniformly and efficiently cooled.
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申请公布号 |
US5889651(A) |
申请公布日期 |
1999.03.30 |
申请号 |
US19960656869 |
申请日期 |
1996.05.30 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
SASAKI, TOMIYA;IWASAKI, HIDEO |
分类号 |
G01R31/28;H01L23/467;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
G01R31/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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