发明名称 Circuit board cooling apparatus
摘要 A supply pipe for supplying air to the peripheral surface of a circuit board container unit is provided in a test head. Nozzles are connected to the supply pipe. Each nozzle has at least one hole opposing a circuit board and corresponding to one IC on the circuit board. The circuit board has a parts mounted portion that generates a small amount of heat. The circuit board is covered with a case. A vent hole is formed on the microscope column side. A discharge pipe is connected to the vent hole and communicates with the outside of the test head. With this arrangement, each circuit board can be uniformly and efficiently cooled.
申请公布号 US5889651(A) 申请公布日期 1999.03.30
申请号 US19960656869 申请日期 1996.05.30
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 SASAKI, TOMIYA;IWASAKI, HIDEO
分类号 G01R31/28;H01L23/467;H05K7/20;(IPC1-7):H05K7/20 主分类号 G01R31/28
代理机构 代理人
主权项
地址
您可能感兴趣的专利