| 摘要 |
PROBLEM TO BE SOLVED: To mount a semiconductor element with its face down on a wiring board, improve the reliability of connection and facilitate the change of the semiconductor element, by mounting metal bumps on electrodes of the element. SOLUTION: A semiconductor device 10 comprises a semiconductor element 12 having electrodes 14 and metal bumps 16 mounted on the electrodes 14. The bump 16 comprises a ball-like core 18 and a surface layer 20 covering the core. The semiconductor element 2 is a bare chip forming a semiconductor integrated circuit and includes conductors 12a to which the electrodes 14 are connected. Face down bonding presses the element 12 being heated to a wiring board to connect the bump 16 mounted on the electrodes 14 of the element 12 to electrodes on the board. Thus, it is possible to realize the face down mounting of ht element on the board, improve the reliability and facilitate changing the elements. |
