| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacture capable of realizing a multilayered wiring board of high quality with a satisfactory yield at low cost. SOLUTION: Projections 5c and 8c for positioning containing metal are formed at plural parts of the circuit pattern non-forming area surface of elements 7, 7' and 8 for lamination. The projections 5c and 8c for positioning are detected by X-ray transmission and pin insertion holes 7a and 8a passed through in a thickness direction are made in an area provided with the projections 5c and 8c for positioning. Thereafter, the elements 7, 7' and 8, where the pin insertion holes 7a and 8a are made, are laminated and positioned by inserting pins for positioning into the pin insertion holes 7a and 8a passed through in the thickness direction, and the laminated and positioned elements 7, 7' and 8 for the lamination are pressed in the thickness direction, laminated and then integrated. |
