| 摘要 |
PROBLEM TO BE SOLVED: To improve reliability and operability by forming a columnar conductive element of conductive polymer thick film paste at a conductor formed on a board, covering its periphery with an insulating layer, and exposing a head of the columnar element embedded in the covered insulating layer by mechanical polishing for forming a conductor. SOLUTION: A conductor circuit 2 is formed on a board 1 by using prior art. Then, a columnar conductive element 10 is formed by using conductive polymer thick film paste. The paste is obtained by dispersing a polymer (resin) binder. Then, a conductive element is formed by forming a film in a predetermined size at a predetermined place by printing, and then curing it. Furthermore, since solid resin is dissolved in solvent to be used for binder, the columnar element 10 having high reliability can be formed. The element 10 can be freely extended or contracted in X, Y and Z directions, air gap is scarcely formed in the element, and residual stress is scarcely retained. Thus, the element 10 having high reliability is obtained. |
