| 摘要 |
PROBLEM TO BE SOLVED: To provide a mechanical and chemical polishing method in which the end point of polishing can be detected easily, while minimizing pattern shift at the time of transferring a photomask. SOLUTION: A wafer carrier 13 holds a fixed wafer 14, while pressing the wafer against a polishing table 12 applied with a polishing pad 11, and then polishing is performed by turning both a polishing cable 12 and the wafer carrier 13. A slurry having specified chemical properties is provided to the contact face between the wafer carrier 13 and the polishing pad 11. Polishing is divided into two stages, i.e., a first stage where a specified difference of rotational speed is set between the polishing cable 12 and the wafer carrier 13, in order to facilitate the detection at the end point and a second stage, where both rotational speeds are synchronized in order to minimize alignment shift. |
