发明名称 Topography simulation method
摘要 In a topography simulation method, the topography of a resist pattern after curing treatment can be precisely estimated without producing a complex physical model or performing parameter measurement. Specifically, in the method of estimating the topography of a resist pattern, which is formed by selectively removing a part of a resist provided on a substrate and contracts due to curing treatment, the resist pattern is divided into a plurality of cells and the cells are contracted in accordance with a volume shrinkage amount per unit volume of the resist in the curing treatment. Then, the cells located closer to an interface between the substrate and the resist pattern are flattened to a higher degree in parallel to the substrate, and the deformed cells are brought together toward a shrinkage reference line passing through a center of a line pattern and toward the substrate.
申请公布号 US5889678(A) 申请公布日期 1999.03.30
申请号 US19970855814 申请日期 1997.05.12
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 INOUE, SOICHI;TANAKA, SATOSHI;MIMOTOGI, SHOJI;ONISHI, YASUNOBU
分类号 G03F7/20;G06F17/50;H01L21/00;H01L21/027;(IPC1-7):G06F17/50 主分类号 G03F7/20
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