| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a large-area compound semiconductor thin film at low costs and with good reproducibility by a method wherein an organic solvent solution as an organometallic compound is changed into fine particles, and the obtained fine particles are brought into contact with a heat-resistant substrate. SOLUTION: A substrate 1 is placed on a heater 10 for substrate heating. An organic solvent solution 9 as an organometallic compound is put into a container 4. A pipe which is extended from a carrier-gas introduction port 7 is connected to a space in the upper part inside the container 4, and an ultrasonic vibrator 5 is installed on its bottom. The container 4 and the substrate 1 are connected by a pipe 8. The substrate side of the pipe 8 is expanded to be a width which covers the substrate 1. When the ultrasonic vibrator 5 is vibrated, the organometallic compound solution 9 is changed into fine particles so as to fill the space in the upper part inside the container 4. Then, the fine particles flow in the pipe 8 by a carrier gas which is introduced from the carrier-gas introduction port 7, the organometallic compound is decomposed on the surface of the substrate 1, and a compound semiconductor film 3 is formed on a transparent electrode 2 on the substrate 1. |
