发明名称 |
Solder material and electronic part using the same |
摘要 |
This invention provides a lead-free high temperature solder material comprising 0.005-3.0 wt % of palladium (Pd) and 97.0-99.995 wt % of tin (Sn) whose liquidus temperature is 200-350 DEG C. The solder material is environmentally-friendly, improved in thermal fatigue property, and it can improve the reliability of electronic apparatuses. A predetermined amount of Sn material and Pd is mixed, vacuum-melted and cast to prepare an ingot. The ingot is rolled to be a tape that is later pressed to obtain a solder pellet. In a preferable composition, at least 95 wt % of Sn and 0.005-3.0 wt 5 of Pd are contained, and 0.1-5.0 wt % of metallic (e.g. Cu, Ni) or alloy particles are added. The average particle diameter is about 40 mu m. A substrate and an IC chip (5) (electronic element) are die-bonded substantially in parallel by a solder material (3) provided between an Ni plating (4) on the lower side of an IC chip (semiconductor) (5) and an Ni plating (2) on a die (1). <IMAGE> |
申请公布号 |
SG63762(A1) |
申请公布日期 |
1999.03.30 |
申请号 |
SG19970003771 |
申请日期 |
1997.10.17 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;TANAKA DENSHI KOGYO K.K. |
发明人 |
AOI KAZUHIRO;OGASHIWA TOSHINORI;ARIKAWA TAKATOSHI;SAWADA YOSHIHARU |
分类号 |
B23K35/26;C22C13/00;H01L21/52;H01L21/60;H01L23/488;H05K3/34 |
主分类号 |
B23K35/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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