| 摘要 |
PROBLEM TO BE SOLVED: To speed up the detection of a bounding wire height to reduce the inspection time by introducing wire pictures on multiple focal planes into a picture processing device successively. SOLUTION: By using light from a lighting system 4 incident on a bonding wire 1 vertically, that is, a falling illumination, of which light energy is controlled by an illumination control device 8, the light is regularly reflected by the top part of the wire and thereby, an image pickup device 3 picks up an image of luminescent spots of which luminance is higher than that of the periphery on the wire. The image pickup device 3 is attached to a Z stage 5, and a Z control device 7 drives the Z stage 5 and can read the height of the image pickup device 3, that is, the height position of the Z stage 5. When pictures are introduced sequentially while the height of the Z stage 5 is being changed in the optical axis direction, the image pickup device 3 picks up wire pictures on different local planes and hence, a picture processing device 6 introduces the pictures successively. |
