HEAT-RESISTANT MOLDED PRODUCT

摘要

PROBLEM TO BE SOLVED: To obtain the subject molded product, comprising a fluororesin molded product exposed to ionizing radiations, having excellent deformation resistance under load and further characteristics such as good chemical resistance essential to the fluororesin and useful as a part of an apparatus for producing semiconductors. SOLUTION: This molded product comprises a fluororesin molded product exposed to ionizing radiations and has <=15% compressive creep at 200 deg.C. The molded product is preferably obtained by exposing a fluororesin which is a tetrafluoroethylene-based polymer or the like in a state heated at the crystal melting point or above thereof in the absence of oxygen to ionizing radiations at l kGy to 5 MGy radiation dose.