| 摘要 |
PROBLEM TO BE SOLVED: To obtain an inspection method in which an electrode is connected surely when an IC chip mounted on a circuit board by a resin, for connection, containing conductive particles is removed so as to be remounted on an evaluation board and in which the reliability of an inspection is enhanced by using the evaluation board whose electrode is formed to be protrusion-shaped. SOLUTION: An evaluation board 6a which is used for an IC chip inspection is constituted in such a way that, e.g. bump electrodes 3 are formed on a glass board 7 on which a conductor pattern 8 is formed. The electrodes 3 are installed in positions faced with bump electrodes 2 on an inspected IC chip, which is removed from a circuit board and to which a resin 4a for connection is stuck. Then, a resin 4b, for connection, which contains conductive particles 5b is arranged between the evaluation board 6a and the IC chip 1, it is heated and pressurized by using a heating and pressurization head or the like, and the IC chip 1 is connected to the evaluation board 6a. By this constitution, a pressure is applied so as to be concentrated between the electrodes 2 and the electrodes 3, a load is not applied to other places, a short circuit or the like can be suppressed, and a stable inspection can be executed. |
