发明名称 THERMOSETTING RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a thermosetting resin composition having a rapid curing rate and imparting excellent heat resistance, mechanical strength and low hygroscopicity to the cured products. SOLUTION: A thermosetting resin composition comprises (A) an unsaturated polyester composed of at least one of cyclohexane-dimethanol, a hydrogenated bisphenol A, a bisphenol A-ethylene oxide adduct and a bisphenol A-propylene oxide adduct as the polyhydric alcohol component; terephthalic acid and isophthalic acid as the saturated polybasic acid component; and fumaric acid as the unsaturated polybasic acid component, (B) diallyl phthalate and (C) an organic peroxide as the polymeriation initiator in such amounts that (i) isophthalic acid in the saturated polybasic acid component is less than 70 mol.%; (ii) the unsaturated polybasic acid component in the total of the saturated polybasic acid component and the unsaturated polybasic acid component is from 10 mol.% to less than 70 mol.%; (iii) component (B) based on the total of components (A) and (B) is from 10 wt.% to less than 70 wt.%; and (iv) component (C) based on the total of components (A) and (B) is from 0.2 wt.% to less than 5 wt.%.
申请公布号 JPH1180286(A) 申请公布日期 1999.03.26
申请号 JP19970239866 申请日期 1997.09.04
申请人 SHOWA HIGHPOLYMER CO LTD 发明人 MATSUI FUMIO;MORITA KATSUHISA;HATANO YOSHITAKA;TAKAHASHI KENTARO
分类号 C08L67/06;C08F283/01;C08G63/547;(IPC1-7):C08F283/01 主分类号 C08L67/06
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