| 摘要 |
PROBLEM TO BE SOLVED: To obtain a heat resistant photosensitive polymer compsn. having high sensitivity, capable of shortening development time and ensuring various satisfactory characteristics of a formed film, in particular adhesiveness to a substrate by incorporating a polyimide having specified repeating units, a polyamic acid having specified repeating units and a photo-acid generator. SOLUTION: The heat resistant photosensitive polymer compsn. contains a polyimide having repeating units represented by formula I, a polyamic acid having repeating units represented by formula II and a photo-acid generator. The top of a substrate is coated with the photosensitive polymer compsn. and this compsn. is dried, exposed, developed and heated to produce the objective relief pattern. In the formula I, R<1> is a tetravalent org. group and R<2> is a divalent org. group having a phenolic hydroxyl group. In the formula II, R<3> is a tetravalent org. group, R<4> is a divalent org. group, R<5> is a monovalent org. group and (q) is an integer of >=1. |
