发明名称 PATTERN FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To obtain a pattern having high resolution, high sensitivity, excellent adhesion property to a substrate, coating property and storage stability without causing environmental pollution by forming a photoset pattern in a process including a step of applying a photosensitive resin compsn. which contains a photosensitive resin having specified structural unit on a substrate to form a photosensitive resin compsn. coating film. SOLUTION: In this pattern forming method, a photosensitive resin compsn. which contains a photosensitive resin having a structural unit expressed by formula I is applied on a substrate to form a photosensitive compsn. coating film. The photosensitive compsn. is exposed to light according to a desired pattern. and the exposed photosensitive compsn. coating film according to the pattern is developed with water or a water-based developer to form a photoset pattern. In formula I, n is 1, 2, or 3, and Ar is selected from formula II. In formula II, X is lithium, sodium, potassium, ammonium, monoalkylammonium, dialkylammonium, trialkylammonium, etc.
申请公布号 JPH1184655(A) 申请公布日期 1999.03.26
申请号 JP19970237490 申请日期 1997.09.02
申请人 TOYO GOSEI KOGYO KK 发明人 SHIBUYA TORU;SHIYA KENEI;TOCHISAWA TETSUAKI
分类号 G03F7/038;C08F16/38;C09D129/14;G02B5/00;G02B5/20;G03F7/40;H01J9/227;H01L21/027;(IPC1-7):G03F7/038 主分类号 G03F7/038
代理机构 代理人
主权项
地址