BALL GRID ARRAY SOCKET ASSEMBLY

摘要

A ball grid array assembly (10) consists of a socket body (24) having a plurality of vias (30) extending therethrough, a plurality of electrically conductive contact assemblies (26) respectively disposed in corresponding vias (30), and a releasable cover plate (28). Each of the contact assemblies (26) includes a lower terminal end for engaging a terminal pad (14) on a circuit board (16), and further includes an upper multi-fingered contact arrangement (48) for engaging a ball contact (20) of a ball grid array package (12). Three separate embodiments are disclosed. In use, the ball grid array package (12) is received in assembled relation with the socket body (24) wherein the ball contacts (20) of the ball grid array package (12) are received into the vias (30) in engaging electrical communication with the upper contact ends of the contacts assemblies (26).