发明名称 MOISTURE-CURABLE ELECTRICALLY-INSULATING RESIN
摘要 <p>The invention refers to a low-toxicity moisture-curable resin comprising at least one polymer (A) having an organic backbone and at least one silicon-containing end group having at least one hydroxyl or hydrolyzable group, whereby said organic polymer is crosslinkable through formation of siloxane bonds, at least one curing catalyst (B), at least one molecular sieve (C), and water (D), wherein the amounts of (C) and (D) are selected so that the cured resin has an insulation resistance, Ri, of at least 10,000 MOhm.</p>
申请公布号 WO1999014766(A1) 申请公布日期 1999.03.25
申请号 US1997016210 申请日期 1997.09.16
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