Material and process for manufacturing composite plastic components, especially electrical components

摘要

The hollow microspheres are expandable or pre-expanded and the amount is not more than 20%. preferably not more than 5vol%, more preferably less than 1vol% of the total material volume. Expandable microspheres are 10 microns across before expansion and expanded microspheres 40-50 microns.- DETAILED DESCRIPTION - INDEPENDENT CLAIMS are made for: a) a process for manufacturing the material in powder form in which the ingredients are mixed in a container by random agitation and/or rotation; b) a composite plastic product(16), especially an electrical component with a switch, e.g. a semi conductor chip(8), and an outer housing(17).Preferred features: The housing material contains expandable or pre-expanded hollow microspheres and can also include fractured hollow microspheres. The material may also have the same thermal expansion coefficient as the components of the semi-conductor chip